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SZ5-M2-W0-C8 Fiches technique(PDF) 30 Page - Seoul Semiconductor

No de pièce SZ5-M2-W0-C8
Description  Superior Efficacy & Lumen output with Small Form Factor
Download  33 Pages
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Fabricant  SEOUL [Seoul Semiconductor]
Site Internet  http://www.seoulsemicon.com
Logo SEOUL - Seoul Semiconductor

SZ5-M2-W0-C8 Fiches technique(HTML) 30 Page - Seoul Semiconductor

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SZ5-M2-WX-XX - High-power LED
 “제품 명 – 제품 군” 을 기입하십시오.
제품 군은 홈페이지 응용분야 분류기준을 참고한다.
(예) SZ5M0WWC9 – High-power LED
30
글씨체는 : Arial, 10pt
 Revision numbering 기준:
• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0
 수정일자 표기형식; YYYY-MM-DD
(예) 2013-04-01
Rev5.0, Sep 13, 2016
Product Data Sheet
Precaution for Use
SSC
표준화결론(개선후)
TOP & SIDETOP & SIDE
MSL (Moisture Sensitive Level)
LEVEL 3
LEVEL 2a
1. Shelf life in Sealing bag
저장기한
(
실링백 상태로)
Months
개월
12
개월
12
개월
Temperature
(maximum)
온도 (이하)
30℃
30℃
Humidity
(maximum)
습도 (미만)
50%RH
50%RH
2. Peak package body temperature
(
제품 최대 온도)
240℃
240℃
3. After this bag is
opened
실링백 개봉 후 조건
hours
시간 (이내)
168 hours
(7days)
672 hours
(28days)
Temperature
(maximum)
온도 (이하)
30℃
30℃
Humidity
(less than)
습도 (미만)-규격
Limit
성격
60%RH
60%RH
Stored
저장조건(미만)
10%RH
10%RH
4. Devices require bake,
before mounting, if:
사용 전 Baking 검사
a. Humiduty
Indicator Card
30%RH
30%RH
Temperature
온도 조건에서
23
±5℃
23
±5℃
b. is not met.
MSL Level (
미만)
3
3
5. If baking is required,
건조(baking) 조건
hours
시간 (이내)
10~24
hours
10~24
hours
Temperature
온도 조건
65
±5℃
65
±5℃
Humidity
(less than)
습도조건 (미만)
10%RH
10%RH
(1) Storage
To avoid the moisture penetration, we recommend storing Z5 Series LEDs in a dry box with a
desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing / Temperature : 5 ~ 30℃ Humidity : less than RH60%
b. If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes, components should be dried for 10-24hr at 65±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) The appearance and specifications of the product may be modified for improvement without
notice.
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.


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