AD8390

Rev. C | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

±13.2 V (26.4 V)

Package Power Dissipation

150°C

–40°C to +85°C

Storage Temperature Range

–65°C to +150°C

Lead Temperature (Soldering 10 s)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

TYPICAL THERMAL PROPERTIES

Table 4.

Package

16-lead LFCSP (CP-16)

JEDEC 2S2P – 0 airflow

Paddle soldered to board

Nine thermal vias in pad

30.4°C/W

16-lead QSOP/EP (RC-16)

JEDEC 1S2P – 0 airflow

Paddle soldered to board

Nine thermal vias in pad

44.3°C/W

49.9

Ω

49.9

Ω

AD8390

Figure 3. Basic Test Circuit

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.