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AUIRFR5305TRL Datasheet(Fiches technique) 1 Page - Infineon Technologies AG

Numéro de pièce AUIRFR5305TRL
Description  AUTOMOTIVE GRADE
Télécharger  11 Pages
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Fabricant  INFINEON [Infineon Technologies AG]
Site Internet  http://www.infineon.com
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 1 page
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AUIRFR5305
AUIRFU5305
VDSS
-55V
RDS(on)
max.
0.065

ID
-31A
Features
 Advanced Planar Technology
 Low On-Resistance
 Dynamic dv/dt Rating
 175°C Operating Temperature
 Fast Switching
 Fully Avalanche Rated
 Repetitive Avalanche Allowed up to Tjmax
 Lead-Free, RoHS Compliant
 Automotive Qualified *
Description
Specifically designed for Automotive applications, this Cellular
Planar design of HEXFET® Power MOSFETs utilizes the latest
processing techniques to achieve low on-resistance per silicon
area. This benefit combined with the fast switching speed and
ruggedized device design that HEXFET power MOSFETs are
well known for, provides the designer with an extremely efficient
and reliable device for use in Automotive and a wide variety of
other applications.
1
2015-10-12
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
 
AUTOMOTIVE GRADE
Symbol
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ -10V
-31
A
ID @ TC = 100°C
Continuous Drain Current, VGS @ -10V
-22
IDM
Pulsed Drain Current 
-110
PD @TC = 25°C
Maximum Power Dissipation
110
W
Linear Derating Factor
0.71
W/°C
VGS
Gate-to-Source Voltage
± 20
V
EAS
Single Pulse Avalanche Energy (Thermally Limited) 
280
mJ
IAR
Avalanche Current 
-16
A
EAR
Repetitive Avalanche Energy 
11
mJ
dv/dt
Peak Diode Recovery dv/dt
-5.0
V/ns
TJ
Operating Junction and
-55 to + 175
 
TSTG
Storage Temperature Range
°C 
Soldering Temperature, for 10 seconds (1.6mm from case)
300
 
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Thermal Resistance  
Symbol
Parameter
Typ.
Max.
Units
RJC
Junction-to-Case
–––
1.4
°C/W
RJA
Junction-to-Ambient ( PCB Mount) 
–––
50
RJA
Junction-to-Ambient 
–––
110
D-Pak
AUIRFR5305
I-Pak
AUIRFU5305
Base part number
Package Type
Standard Pack
Form
Quantity
AUIRFU5305
I-Pak
Tube
75
AUIRFU5305
AUIRFR5305
D-Pak
Tube
75
AUIRFR5305
Tape and Reel Left
3000
AUIRFR5305TRL
Orderable Part Number
G
D
S
Gate
Drain
Source
G
S
D
D
S
G
D




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