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CYW20704 Fiches technique(PDF) 3 Page - Cypress Semiconductor

No de pièce CYW20704
Description  Single-Chip Bluetooth Transceiver and Baseband Processor
Download  49 Pages
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Fabricant  CYPRESS [Cypress Semiconductor]
Site Internet  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CYW20704 Fiches technique(HTML) 3 Page - Cypress Semiconductor

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Document Number: 002-14786 Rev. *E
Page 3 of 50
CYW20704
Contents
1. Overview............................................................ 4
1.1 Overview ............................................................. 4
1.2 Major Features .................................................... 4
1.3 Block Diagram ..................................................... 5
1.2 Usage Model ....................................................... 6
2. Integrated Radio Transceiver .......................... 7
2.1 Transmit .............................................................. 7
2.2 Receiver .............................................................. 7
2.3 Local Oscillator Generation ................................. 7
2.4 Calibration ........................................................... 7
2.5 Internal LDO ........................................................ 8
3. Bluetooth Baseband Core ............................... 9
3.1 Bluetooth Low Energy ......................................... 9
3.2 Bluetooth 4.1 Features ........................................ 9
3.3 Bluetooth 4.0 Features ........................................ 9
3.4 Link Control Layer ............................................. 10
3.5 Test Mode Support ............................................ 10
3.6 Power Management Unit ................................... 10
3.7 Adaptive Frequency Hopping ............................ 11
3.8 Collaborative Coexistence ................................ 12
3.9 Global Coexistence Interface ............................ 12
3.10 Recommended BT Coexistence Interface
Assignments ...................................................... 12
4. Microprocessor Unit....................................... 13
4.1 Overview ........................................................... 13
4.2 NVRAM Configuration Data and Storage .......... 13
4.3 EEPROM ............................................................13
4.4 External Reset ....................................................13
4.5 One-Time Programmable Memory .....................14
5. Peripheral Transport Unit .............................. 15
5.1 PCM Interface ....................................................15
5.2 HCI Transport Detection Configuration ..............16
5.3 USB Interface .....................................................17
5.4 UART Interface ..................................................18
5.5 Simultaneous UART Transport and Bridging .....18
6. Frequency References................................... 19
6.1 Crystal Interface and Clock Generation .............20
6.2 Crystal Oscillator ................................................20
6.3 Frequency Selection ..........................................20
6.4 Frequency Trimming ..........................................20
7. Pin-out and Signal Descriptions ................... 21
7.1 Pin Descriptions .................................................21
8. Ball Grid Arrays .............................................. 23
9. Electrical Characteristics .............................. 24
9.1 RF Specifications ...............................................27
9.2 Timing and AC Characteristics ...........................31
9.3 I2S Interface .......................................................39
10. Mechanical Information ................................. 45
10.1 Tape, Reel, and Packing Specification ..............46
11. Ordering Information ..................................... 47
Document History........................................................... 48


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