Datasheet

Datasheet

3/16

BD1LB500 Series

TSZ02201-0G3G0BD00040-1-2

© 2015 ROHM Co., Ltd. All rights reserved.

2015.11.10 Rev.007

www.rohm.co.jp

TSZ22111・15・001

Absolute Maximum Ratings

Item

Symbol

Limit values

Unit

DRAIN-SOURCE voltage

42 (internally limited)

V

Power supply voltage

7

V

Diagnostic output voltage

-0.3 to +7

(1)

V

Output current (DC)

0.8

(2)

A

Output current (Pulse)

Internally limited

(3)

A

Input voltage

-0.3 to +7

(1)

V

Power consumption

Pd

2.1(HTSOP-J8)

(4)

W

0.587(MSOP8)

(5)

Operating temperature range

°C

Storage temperature range

-55 to +150

°C

Maximum junction temperature

150

°C

Active clamp energy (single pulse)

25

(6)

mJ

Operating Voltage Ratings

Item

Code

Limit values

Unit

Operating voltage range

3.5 to 5.5

V

(2) The value must not exceed Pd.

(3) Internally limited by the overcurrent limiting circuit.

(4) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 2-layer substrate).

When using at Ta ≥ 25°C, power dissipation is reduced at 16.8mW/°C.

(5) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area is Footprint only, glass epoxy single-layer substrate).

When using at Ta ≥ 25°C, power dissipation is reduced at 4.7mW/°C.

Heat Dissipation Characteristics

(HTSOP-J8)

(1) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 4-layer substrate)

When using at Ta ≥ 25°C, power dissipation is reduced at 30mW/°C.

(2) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 2-layer substrate)

When using at Ta ≥ 25°C, power dissipation is reduced at 16.8mW/°C.

(MSOP8)

(3) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area is Footprint only, glass epoxy single-layer

substrate)

When using at Ta ≥ 25°C, power dissipation is reduced at 4.7mW/°C.

0.00

0.50

1.00

1.50

2.00

2.50

3.00

3.50

4.00

0

25

50

75

100

125

150

Ｔa [℃]

0.587 W

2.1 W

3.75 W

HTSOP-J8

(1)

HTSOP-J8

(2)

MSOP8

(3)