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UC2909MDWREP Fiches technique(PDF) 6 Page - Texas Instruments |
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UC2909MDWREP Fiches technique(HTML) 6 Page - Texas Instruments |
6 / 21 page 0.1 1.0 10.0 100.0 1000.0 80 90 100 110 120 130 140 150 160 170 180 Continuous TJ (°C) Wirebond Voiding Fail Mode Electromigration Fail Mode Notes: 1. See datasheet for absolute maximum and minimum recommended operating conditions. 2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life). 3. Enhanced plastic product disclaimer applies. UC2909-EP SLUSA72 – JULY 2010 www.ti.com Figure 2. UC2909-EP Operating Life Derating Chart 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): UC2909-EP |
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