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MC10LVEP11DTR2G Fiches technique(PDF) 7 Page - ON Semiconductor |
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MC10LVEP11DTR2G Fiches technique(HTML) 7 Page - ON Semiconductor |
7 / 13 page MC10LVEP11, MC100LVEP11 www.onsemi.com 7 Table 10. AC CHARACTERISTICS (VCC = 0 V; VEE = −3.8 V to −2.375 V or VCC = 2.375 V to 3.8 V; VEE = 0 V (Note 1)) Symbol Characteristic −40°C 25°C 85°C Unit Min Typ Max Min Typ Max Min Typ Max fmax Maximum Frequency (Figure 2) 3 3 3 GHz tPLH, tPHL Propagation Delay (Differential Configuration) CLK to Q, Q 170 230 300 180 240 310 210 270 360 ps tSKEW Within Device Skew Q, Q Device to Device Skew (Note 2) 5.0 20 130 5.0 20 130 5.0 20 150 ps tJITTER CLOCK Random Jitter (RMS) @ v1.0 GHz @ v1.5 GHz @ v2.0 GHz @ v2.5 GHz @ v3.0 GHz 0.126 0.112 0.111 0.112 0.155 0.3 0.2 0.3 0.2 0.2 0.142 0.162 0.122 0.172 0.217 0.4 0.3 0.2 0.3 0.3 0.209 0.162 0.170 0.235 0.368 0.3 0.2 0.3 0.3 0.6 ps VPP Input Voltage Swing (Differential Configuration) 150 800 1200 150 800 1200 150 800 1200 mV tr tf Output Rise/Fall Times Q, Q (20% − 80%) 70 110 170 80 120 180 100 140 200 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V. 2. Skew is measured between outputs under identical transitions. 0 100 200 300 400 500 600 700 800 900 1000 0 1000 2000 3000 4000 FREQUENCY (MHz) Figure 2. Fmax Typical 3.3 V 2.5 V |
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