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INA337 Fiches technique(PDF) 2 Page - Texas Instruments |
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INA337 Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 14 page INA337, INA338 2 SBOS222A www.ti.com SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY INA337 MSOP-8 DGK –40 °C to +125°C BIM INA337AIDGKT Tape and Reel, 250 " """ " INA337AIDGKR Tape and Reel, 2500 INA338 MSOP-10 DGS –40 °C to +125°C BIL INA338AIDGST Tape and Reel, 250 " """ " INA338AIDGSR Tape and Reel, 2500 NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com. PACKAGE/ORDERING INFORMATION ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage .................................................................................. +5.5V Signal Input Terminals: Voltage(2) ......................................... –0.5V to (V+) + 0.5V Current(2) ........................................................................ ±10mA Output Short-Circuit ................................................................. Continuous Operating Temperature Range ....................................... –40 °C to +150°C Storage Temperature Range .......................................... –65 °C to +150°C Junction Temperature .................................................................... +150 °C Lead Temperature (soldering, 10s) ............................................... +300 °C NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper han- dling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 1 2 3 4 8 7 6 5 R 1 V+ V O R 2 R 1 V IN– V IN+ V– INA337 MSOP-8 1 2 3 4 5 10 9 8 7 6 R 1 V+ V O R 2 Enable R 1 V IN– V IN+ V– (Connect to V+) INA338 MSOP-10 Top View PIN CONFIGURATION |
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