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SN74AUP1G08QDCKRQ1 Fiches technique(PDF) 2 Page - Texas Instruments |
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SN74AUP1G08QDCKRQ1 Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 15 page Y + A • B or Y + A ) B −0.5 0 0.5 1 1.5 2 2.5 3 3.5 0 5 10 15 20 25 30 35 40 45 Time − ns † AUP1G08 data at CL = 15 pF Output Input Switching Characteristics at 25 MHz† AUP LVC AUP AUP LVC Static-Power Consumption ( µA) Dynamic-Power Consumption (pF) † Single, dual, and triple gates 3.3-V Logic† 3.3-V Logic† 0% 20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100% SN74AUP1G08-Q1 SCES847 – DECEMBER 2012 www.ti.com DESCRIPTION The AUP family is TI's premier solution to the low-power needs of the industry in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). Figure 1. AUP – The Lowest-Power Family Figure 2. Excellent Signal Integrity This single 2-input positive-AND gate performs the Boolean function: in positive logic. NanoStar package technology is a major breakthrough in integrated circuit (IC) packaging concepts, because it uses the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TA ORDERABLE PART NUMBER(2) TOP-SIDE MARKING –40°C to 125°C SN74AUP1G08QDCKRQ1 SIT (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: SN74AUP1G08-Q1 |
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