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LM2672M-12 Fiches technique(PDF) 4 Page - Texas Instruments |
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LM2672M-12 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 36 page 4 LM2672 SNVS136L – SEPTEMBER 1998 – REVISED JUNE 2016 www.ti.com Product Folder Links: LM2672 Submit Documentation Feedback Copyright © 1998–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over recommended operating junction temperature range of –40°C to 125°C (unless otherwise noted) (1) MIN MAX UNIT Supply voltage 45 V ON/OFF pin voltage, VSH –0.1 6 V Switch voltage to ground –1 V Boost pin voltage VSW + 8 V Feedback pin voltage, VFB –0.3 14 V Power dissipation Internally limited Lead temperature D package Vapor phase (60s) 215 °C Infrared (15s) 220 P package (soldering, 10s) 260 Maximum junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage 6.5 40 V TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) Thermal resistances were simulated on 4-layer JEDEC board. 7.4 Thermal Information THERMAL METRIC(1)(2) LM2672 UNIT D (SOIC) P (PDIP) WSON (NHN) 8 PINS 8 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 105 95 — °C/W RθJC(top) Junction-to-case (top) thermal resistance — — — °C/W RθJB Junction-to-board thermal resistance — — — °C/W ψJT Junction-to-top characterization parameter — — — °C/W ψJB Junction-to-board characterization parameter — — — °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W |
Numéro de pièce similaire - LM2672M-12 |
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Description similaire - LM2672M-12 |
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