LM27

V+

GND

HYST

OS, OS, US

or US

1

2

3

4

5

LM27

SNIS124D – AUGUST 2002 – REVISED JULY 2013

www.ti.com

Orderable Device

Trip Point Temperature (°C)

Digital Output Function

LM27CIM5-ZHJ

120

Active-Low, Open-Drain, OS output

LM27CIM5-1HJ

130

Active-Low, Open-Drain, OS output

LM27CIM5-2HJ

140

Active-Low, Open-Drain, OS output

(1)

Other device options have not been released to market, contact Texas Instruments for volume and other requirements for release.

Connection Diagram

PIN DESCRIPTIONS

Pin Number

Pin Name

Function

Connection

1

HYST

Hysteresis control, digital input

2

GND

Ground, connected to the back side of

System GND

the die through lead frame.

3

Analog output voltage proportional to

Leave floating or connect to a high impedance node.

temperature

4

Supply input

2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR

information see NOISE CONSIDERATIONS.

OS

Overtemperature Shutdown open-drain Controller interrupt, system or power supply shutdown;

active low thermostat digital output

pull-up resistor

≥ 10kΩ

OS

Overtemperature Shutdown totem-pull

Controller interrupt, system or power supply shutdown

active high thermostat digital output

US

Undertemperature Shutdown open-

System or power supply shutdown; pull-up resistor

≥ 10kΩ

drain active low thermostat digital

output

US

Undertemperature Shutdown totem-

System or power supply shutdown

pull active high thermostat digital

output

(1)

Pin 5 functionality and trip point setting are programmed during LM27 manufacture.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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