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LM2592HVSX-ADJ Fiches technique(PDF) 4 Page - Texas Instruments |
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LM2592HVSX-ADJ Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 31 page 4 LM2592HV SNVS075E – MAY 2001 – REVISED MAY 2016 www.ti.com Product Folder Links: LM2592HV Submit Documentation Feedback Copyright © 2001–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT Maximum supply voltage (VIN) 63 V ON/OFF pin voltage −0.3 25 V Feedback pin voltage −0.3 25 V Output voltage to ground (steady-state) −1 V Power dissipation Internally limited Lead temperature KTT package Vapor phase (60 sec.) 215 °C Infrared (10 sec.) 245 NDH package Soldering (10 sec.) 260 Maximum junction temperature 150 °C Storage temperature, Tstg −65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V 7.3 Recommended Operating Conditions MIN MAX UNIT Temperature −40 125 °C Supply voltage 4.5 60 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance to JESD 51-7 (3) Thermal Resistances were simulated on a 4-layer, JEDEC board 7.4 Thermal Information THERMAL METRIC(1) LM2591HV UNIT KTT (DDPAK/TO-263) NDH (TO-220) 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance See (2)(3) 50 50 °C/W RθJC(top) Junction-to-case (top) thermal resistance 2 2 °C/W |
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