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74LVCHR16245AZRDR Fiches technique(PDF) 7 Page - Texas Instruments |
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74LVCHR16245AZRDR Fiches technique(HTML) 7 Page - Texas Instruments |
7 / 28 page SN74LVCHR16245A www.ti.com SCAS582Q – NOVEMBER 1996 – REVISED OCTOBER 2014 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Operating 1.65 3.6 VCC Supply voltage V Data retention only 1.5 VCC = 1.65 V to 1.95 V 0.65 × VCC VIH High-level input voltage VCC = 2.3 V to 2.7 V 1.7 V VCC = 2.7 V to 3.6 V 2 VCC = 1.65 V to 1.95 V 0.35 × VCC VIL Low-level input voltage VCC = 2.3 V to 2.7 V 0.7 V VCC = 2.7 V to 3.6 V 0.8 VI Input voltage 0 5.5 V High or low state 0 VCC VO Output voltage V 3-state 0 5.5 VCC = 1.65 V –2 VCC = 2.3 V –4 IOH High-level output current mA VCC = 2.7 V –8 VCC = 3 V –12 VCC = 1.65 V 2 VCC = 2.3 V 4 IOL Low-level output current mA VCC = 2.7 V 8 VCC = 3 V 12 Δt/Δv Input transition rise or fall rate 10 ns/V TA Operating free-air temperature –40 125 °C (1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 7.4 Thermal Information SN74LVCHR16245A THERMAL METRIC(1) DGG DGV DL UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 64.3 78.4 68.4 RθJC(top) Junction-to-case (top) thermal resistance 17.6 30.7 34.7 RθJB Junction-to-board thermal resistance 31.5 41.8 41.0 °C/W ψJT Junction-to-top characterization parameter 1.1 3.8 12.3 ψJB Junction-to-board characterization parameter 31.2 41.3 40.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). Copyright © 1996–2014, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: SN74LVCHR16245A |
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