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ADCS7477 Fiches technique(PDF) 4 Page - Texas Instruments |
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ADCS7477 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 33 page 4 ADCS7476, ADCS7477, ADCS7478 SNAS192G – APRIL 2003 – REVISED MAY 2016 www.ti.com Product Folder Links: ADCS7476 ADCS7477 ADCS7478 Submit Documentation Feedback Copyright © 2003–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Supply voltage, VDD –0.3 6.5 V Voltage on any analog pin to GND –0.3 VDD + 0.3 V Voltage on any digital pin to GND –0.3 6.5 V Input current at any pin (except power supply pins) ±10 mA Soldering temperature, infrared (10 sec) 215 °C Operating temperature, TA 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±200 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VDD Supply voltage 2.7 5.25 V Digital input pins voltage (independent of supply voltage) 2.7 5.25 V TA Operating temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) ADCS7476, ADCS7477, ADCS7478 UNIT DBV (SOT-23) 6 PINS RθJA Junction-to-ambient thermal resistance 184.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 151.2 °C/W RθJB Junction-to-board thermal resistance 29.7 °C/W ψJT Junction-to-top characterization parameter 29.8 °C/W ψJB Junction-to-board characterization parameter 29.1 °C/W |
Numéro de pièce similaire - ADCS7477 |
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Description similaire - ADCS7477 |
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