3

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FAN5307 Rev. 1.0.4

Absolute Maximum Ratings

Recommended Operating Conditions

Notes:

1. Junction to ambient thermal resistance,

θ

number of copper planes, number of vias used, diameter of via used, available copper surface, and attached heat

sink characteristics.

2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).

3. Refer to the applications section for further details.

Parameter

Min

Max

Unit

-0.3

6.5

V

Voltage on any other pin

GND-0.3

V

Thermal Resistance (Note 1)

Junction to case, SOT-23

130

°C/W

Junction to tab, MLP 3x3

8

Lead Soldering Temperature (10 seconds)

260

°C

Storage Temperature

-65

150

°C

Electrostatic Discharge (ESD) Protection

Level (Note 2)

HBM

4

kV

CDM

1

Parameter

Min

Typ

Max

Unit

Supply Voltage Range

2.5

5.5

V

Output Voltage Range, Adjustable Version

0.7

V

Output Current

300

mA

Inductor (Note 3)

10

µH

Input Capacitor (Note 3)

4.7

µF

Output Capacitor (Note 3)

10

µF

Operating Ambient Temperature Range

-40

+85

°C

Operating Junction Temperature Range

-40

+125

°C