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SN74CB3T3245DW Fiches technique(PDF) 4 Page - Texas Instruments

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No de pièce SN74CB3T3245DW
Description  8-Bit FET Bus Switch
Download  28 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

SN74CB3T3245DW Fiches technique(HTML) 4 Page - Texas Instruments

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SN74CB3T3245
SCDS136B – OCTOBER 2003 – REVISED JUNE 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage(2)
–0.5
7
V
VIN
Control input voltage(2)(3)
–0.5
7
V
VI/O
Switch I/O voltage(2)(3)(4)
–0.5
7
V
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
II/O
ON-state switch current(5)
±128
mA
Continuous current through VCC or GND
±100
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground unless otherwise specified.
(3)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4)
VI and VO are used to denote specific conditions for VI/O.
(5)
II and IO are used to denote specific conditions for II/O.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±1000
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
2.3
3.6
V
VCC = 2.3 V to 2.7 V
1.7
5.5
VIH
High-level control input voltage
V
VCC = 2.7 V to 3.6 V
2
5.5
VCC = 2.3 V to 2.7 V
0
0.7
VIL
Low-level control input voltage
V
VCC = 2.7 V to 3.6 V
0
0.8
VI/O
Data input/output voltage
0
5.5
V
TA
Operating free-air temperature
–40
85
°C
(1)
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
6.4 Thermal Information
SN74CB3T3245
DBQ (SSOP)
DGV
DW (SOIC)
PW (TSSOP)
THERMAL METRIC(1)
UNIT
(TVSOP)
20 PINS
20 PINS
20 PINS
20 PINS
RθJA
Junction-to-ambient thermal resistance
68
92
58
83
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2003–2015, Texas Instruments Incorporated
Product Folder Links: SN74CB3T3245


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