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ST60-18P Fiches technique(PDF) 11 Page - Hirose Electric |
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ST60-18P Fiches technique(HTML) 11 Page - Hirose Electric |
11 / 10 page 11 BRecommended Temperature Profile (Lead-free soldering compound) (ç) 250 240ç 230ç min 180ç 150ç 200 150 100 60S 30S 50 HRS test conditions Solder composition: Paste, 96.5%Sn/3.0%Ag/0.5%Cu Test board: Glass epoxy 35mm∞35mm∞0.8mm thick The temperature profiles are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. |
Numéro de pièce similaire - ST60-18P |
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Description similaire - ST60-18P |
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