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LM3642TLE Fiches technique(PDF) 4 Page - Texas Instruments

No de pièce LM3642TLE
Description  Synchronous Boost LED Flash Driver
Download  30 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

LM3642TLE Fiches technique(HTML) 4 Page - Texas Instruments

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LM3642
SNVS891H – SEPTEMBER 2012 – REVISED SEPTEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
VIN, VSW,VOUT
–0.3
6
V
VSCL, VSDA, VSTROBE, VTX, VLED
the lesser of (VIN+0.3) w/
–0.3
Vmax
V
Continuous power dissipation(4)
Internally limited
Junction temperature (TJ-MAX)
150
°C
Maximum lead temperature (soldering)
See(5)
Storage temperature, Tstg
−65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.
(4)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typical) and
disengages at TJ = 135°C (typical). Thermal shutdown is verified by design.
(5)
For detailed soldering specifications and information, refer to Texas Instruments Application Note 1112: DSBGA Wafer Level Chip Scale
Package (SNVA009).
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VIN
2.5
5.5
V
Junction temperature (TJ)
–40
125
°C
Ambient temperature (TA)
(2)
–40
85
°C
(1)
All voltages are with respect to the potential at the GND pin.
(2)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
6.4 Thermal Information
LM3642
THERMAL METRIC(1)
YZR (DSBGA)
UNIT
9 PINS
RθJA
Junction-to-ambient thermal resistance
100.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
0.7
°C/W
RθJB
Junction-to-board thermal resistance
16.4
°C/W
ψJT
Junction-to-top characterization parameter
3.2
°C/W
ψJB
Junction-to-board characterization parameter
16.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: LM3642


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