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LM3445MM Fiches technique(PDF) 4 Page - Texas Instruments |
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LM3445MM Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 42 page LM3445 SNVS570M – JANUARY 2009 – REVISED NOVEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings See (1) (2) (3) MIN MAX UNIT BLDR to GND –0.3 17 V VCC, GATE, FLTR1 to GND –0.3 14 V ISNS to GND –0.3 2.5 V ASNS, DIM, FLTR2, COFF to GND –0.3 7 V COFF Input Current 100 mA Continuous Power Dissipation(4) Internally Limited Junction Temperature (TJ-MAX) 150 °C Storage Temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) All voltages are with respect to the potential at the GND pin, unless otherwise specified. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 165°C (typ.) and disengages at +TJ = 145°C (typ). 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1000 C101(3) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) Human Body Model, applicable std. JESD22-A114-C. (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN MAX UNIT VCC 8 12 V Junction Temperature –40 125 °C 6.4 Thermal Information LM3445 THERMAL METRIC(1) DGS (VSSOP) D (SOIC) UNIT 10 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 159 82.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 54.5 40.2 °C/W RθJB Junction-to-board thermal resistance 78.7 37.5 °C/W ψJT Junction-to-top characterization parameter 5.3 6.4 °C/W ψJB Junction-to-board characterization parameter 77.5 37.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: LM3445 |
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