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TLP2355 Fiches technique(PDF) 2 Page - Toshiba Semiconductor |
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TLP2355 Fiches technique(HTML) 2 Page - Toshiba Semiconductor |
2 / 11 page TLP2355 2 4. 4. 4. 4. Packaging and Pin Configuration Packaging and Pin Configuration Packaging and Pin Configuration Packaging and Pin Configuration 11-4L1S 1: Anode 3: Cathode 4: GND 5: VO(output) 6: VCC 5. 5. 5. 5. Internal Circuit (Note) Internal Circuit (Note) Internal Circuit (Note) Internal Circuit (Note) Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4. 6. 6. 6. 6. Principle of Operation Principle of Operation Principle of Operation Principle of Operation 6.1. 6.1. 6.1. 6.1. Truth Table Truth Table Truth Table Truth Table Input H L LED ON OFF Output H L 6.2. 6.2. 6.2. 6.2. Mechanical Parameters Mechanical Parameters Mechanical Parameters Mechanical Parameters Characteristics Creepage distances Clearance Internal isolation thickness Min 5.0 5.0 0.4 Unit mm 2016-01-05 Rev.5.0 ©2016 Toshiba Corporation |
Numéro de pièce similaire - TLP2355 |
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Description similaire - TLP2355 |
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