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LM3554 Fiches technique(PDF) 4 Page - Texas Instruments

No de pièce LM3554
Description  Synchronous Boost Converter
Download  47 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

LM3554 Fiches technique(HTML) 4 Page - Texas Instruments

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LM3554
SNVS549C – JUNE 2009 – REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: LM3554
Submit Documentation Feedback
Copyright © 2009–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typical) and
disengages at TJ=135°C (typical).
(5)
For detailed soldering specifications and information, refer to AN1112 DSBGA Wafer Level Chip-Scale Package (SNVA009).
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
VIN, VSW, VOUT
–0.3
6
V
VSCL, VSDA, VHWEN, VSTROBE, VTX1/TORCH, VENVM/TX2, VLED1, VLED2, VLEDI/NTC
0.3 V to (VIN + 0.3 V)
w/ 6 V max
Continuous power dissipation(4)
Internally limit
Junction temperature, TJ-MAX
150
°C
Maximum lead temperature (soldering)
See(5)
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
All voltages are with respect to the potential at the GND pin.
(2)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
NOM
MAX
UNIT
Input voltage, VIN
2.5
5.5
V
Junction temperature, TJ
–30
125
°C
Ambient temperature, TA
(2)
–30
85
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
LM3554
UNIT
YFQ (DSBGA)
16 PINS
RθJA
Junction-to-ambient thermal resistance
75.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
0.5
°C/W
RθJB
Junction-to-board thermal resistance
16.5
°C/W
ψJT
Junction-to-top characterization parameter
0.3
°C/W
ψJB
Junction-to-board characterization parameter
16.4
°C/W


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