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LM3554 Fiches technique(PDF) 4 Page - Texas Instruments |
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LM3554 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 47 page 4 LM3554 SNVS549C – JUNE 2009 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: LM3554 Submit Documentation Feedback Copyright © 2009–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pin. (3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typical) and disengages at TJ=135°C (typical). (5) For detailed soldering specifications and information, refer to AN1112 DSBGA Wafer Level Chip-Scale Package (SNVA009). 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT VIN, VSW, VOUT –0.3 6 V VSCL, VSDA, VHWEN, VSTROBE, VTX1/TORCH, VENVM/TX2, VLED1, VLED2, VLEDI/NTC 0.3 V to (VIN + 0.3 V) w/ 6 V max Continuous power dissipation(4) Internally limit Junction temperature, TJ-MAX 150 °C Maximum lead temperature (soldering) See(5) Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) All voltages are with respect to the potential at the GND pin. (2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN NOM MAX UNIT Input voltage, VIN 2.5 5.5 V Junction temperature, TJ –30 125 °C Ambient temperature, TA (2) –30 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LM3554 UNIT YFQ (DSBGA) 16 PINS RθJA Junction-to-ambient thermal resistance 75.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.5 °C/W RθJB Junction-to-board thermal resistance 16.5 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-board characterization parameter 16.4 °C/W |
Numéro de pièce similaire - LM3554_16 |
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Description similaire - LM3554_16 |
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