TPD4E6B06

SLVSCK3A – MAY 2014 – REVISED DECEMBER 2015

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input pin voltage

–5.5

5.5

V

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

TPD4E6B06

DPW (X2SON)

UNIT

5 PINS

Junction-to-ambient thermal resistance

291.8

°C/W

Junction-to-case (top) thermal resistance

224.2

°C/W

Junction-to-board thermal resistance

245.8

°C/W

Junction-to-top characterization parameter

31.4

°C/W

Junction-to-board characterization parameter

245.6

°C/W

Junction-to-case (bottom) thermal resistance

195.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

Reverse stand-off voltage

–5.5

5.5

V

Break-down voltage

6

V

Break-down voltage

6

V

Leakage current

100

nA

I = 1 A, IO to GND, 8/20

10

V

I = 5 A, IO to GND, 8/20

13

V

Clamp voltage with ESD strike

I = 1 A, IO to GND, 8/20

9

V

I = 5 A, IO to GND, 8/20

13

V

0.75

Ω

Dynamic resistance

0.65

Ω

IO capacitance

4.8

7

pF

(1)

Non-repetitive current pulse 8/20 us exponentially decaying waveform according to IEC61000-4-5

(2)

Extraction of RDYN using least squares fit of TLP characteristics between I = 10 A and I =20 A

4

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