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TLC555-Q1 Fiches technique(PDF) 4 Page - Texas Instruments |
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TLC555-Q1 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 25 page TLC555-Q1 SLFS078B – OCTOBER 2006 – REVISED OCTOBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD Supply voltage(2) 18 V VI Input voltage Any input –0.3 VDD V Sink current, discharge or output 150 mA IO Source current, output 15 mA See Dissipation Continuous total power dissipation Ratings TA Operating free-air temperature –40 125 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network GND. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q100-002(1) ±1000 All pins ±500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Corner pins (1, 4, 5, and Q100-011 ±750 8) (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions MIN MAX UNIT VDD Supply voltage 2 15 V TA Operating free-air temperature –40 125 °C 7.4 Thermal Information TLC555-Q1 THERMAL METRIC(1) D (SOIC) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 113.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58 °C/W RθJB Junction-to-board thermal resistance 54.5 °C/W ψJT Junction-to-top characterization parameter 11.1 °C/W ψJB Junction-to-board characterization parameter 53.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TLC555-Q1 |
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