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TPA6130A2RTJT Fiches technique(PDF) 5 Page - Texas Instruments

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No de pièce TPA6130A2RTJT
Description  Stereo Headphone Amplifier
Download  39 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

TPA6130A2RTJT Fiches technique(HTML) 5 Page - Texas Instruments

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TPA6130A2
www.ti.com
SLOS488F – NOVEMBER 2006 – REVISED MARCH 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage, VDD
–0.3
6.0
V
RIGHTINx, LEFTINx
–2.5
3.6
V
VI
Input voltage
SD, SCL, SDA
–0.3
7
V
Output continuous total power dissipation
See the Thermal Information table
TA
Operating free-air temperature range
–40
85
°C
TJ
Operating junction temperature range
–40
150
°C
Minimum Load Impedance
12.8
12.8
Ω
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
–8
8
kV
output pins(1)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
V(ESD)
Electrostatic discharge
–3.5
3.5
kV
other pins(1)
Charged device model (CDM), per JEDEC specification
–1500
1500
V
JESD22-C101, all pins (2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VDD
Supply voltage
2.5
5.5
V
VIH
High-level input voltage
SCL, SDA, SD
1.3
V
SCL, SDA
0.6
V
VIL
Low-level input voltage
SD
0.35
V
7.4 Thermal Information
RTJ
YZH
THERMAL METRIC(1)
UNIT
20 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
34.8
75
RθJCtop
Junction-to-case (top) thermal resistance
32.5
22
RθJB
Junction-to-board thermal resistance
11.6
26
°C/W
ψJT
Junction-to-top characterization parameter
0.4
0.2
ψJB
Junction-to-board characterization parameter
11.6
24
RθJCbot
Junction-to-case (bottom) thermal resistance
3.1
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2006–2015, Texas Instruments Incorporated
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