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BU406TU Fiches technique(PDF) 4 Page - Fairchild Semiconductor |
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BU406TU Fiches technique(HTML) 4 Page - Fairchild Semiconductor |
4 / 5 page © 2000 Fairchild Semiconductor Corporation www.fairchildsemi.com BU406 Rev. 1.2.1 4 Physical Dimensions Figure 7. TO-220, MOLDED, 3-LEAD, JEDEC VARIATION AB Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/TO/TO220Y03.pdf. For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packing_dwg/PKG-TO220Y03_SHEDCL.pdf. TO-220 |
Numéro de pièce similaire - BU406TU |
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Description similaire - BU406TU |
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