CYStech Electronics Corp.

Spec. No. : C141H8

Issued Date : 2015.10.13

Revised Date :

Page No. : 9/9

MTB015N10QH8

CYStek Product Specification

DFN5×6 Dimension

Millimeters

Inches

Millimeters

Inches

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.900

1.000

0.035

0.039

k

1.190

1.390

0.047

0.055

A3

0.254 REF

0.010 REF

b

0.350

0.450

0.014

0.018

D

4.944

5.096

0.195

0.201

e

1.270 TYP.

0.050 TYP.

E

5.974

6.126

0.235

0.241

L

0.559

0.711

0.022

0.028

D1

3.910

4.110

0.154

0.162

L1

0.424

0.576

0.017

0.023

E1

3.375

3.575

0.133

0.141

H

0.574

0.726

0.023

0.029

D2

4.824

4.976

0.190

0.196

θ

10°

12°

10°

12°

E2

5.674

5.826

0.223

0.229

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Marking :

B015

N10Q

Device

Name

Date Code

8-Lead DFN5×6 Plastic Package

CYS Package Code : H8