TPS2814 datasheet(3/40 Pages) TI1

No de pièce	TPS2814

Description	DUAL HIGH-SPEED MOSFET DRIVERS

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Fabricant	TI1 [Texas Instruments]

Site Internet	http://www.ti.com

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TPS2811, TPS2812, TPS2813, TPS2814, TPS2815

DUAL HIGHSPEED MOSFET DRIVERS

SLVS132F − NOVEMBER 1995 − REVISED OCTOBER 2004

3

www.ti.com

TPS28xxY chip information

This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal compression

or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with conductive

epoxy or a gold-silicon preform.

57

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax OPERATING TEMPERATURE = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

(7)

(6)

(1)

(5)

(2)

(3)

GND

1OUT

VCC

REG_IN

1IN

TPS2811Y

TPS2812Y

TPS2813Y

REG_OUT

(8)

(4)

2IN

47

(1)

(8)

(7)

(2)

(3)

(4)

(5)

(6)

2OUT

(6)

(5)

(1)

(4)

(2)

(8)

GND

1OUT

VCC

1IN1

1IN2

TPS2814Y

(7)

(3)

2IN1

2OUT

2IN2

(6)

(5)

(1)

(4)

(2)

(8)

GND

1OUT

VCC

1IN1

1IN2

TPS2815Y

(7)

(3)

2IN1

2OUT

2IN2

Numéro de pièce similaire - TPS2814

Fabricant	No de pièce	Fiches technique	Description
Texas Instruments	TPS2814	663Kb / 31P	[Old version datasheet] DUAL HIGH-SPEED MOSFET DRIVERS
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	TPS2814DG4	1Mb / 38P	[Old version datasheet] DUAL HIGH-SPEED MOSFET DRIBERS
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