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TMP709 Fiches technique(PDF) 7 Page - Texas Instruments

No de pièce TMP709
Description  Resistor-Programmable Temperature Switch in SOT Package
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
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TMP709 Fiches technique(HTML) 7 Page - Texas Instruments

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TMP709
www.ti.com
SBOS583A
– DECEMBER 2011 – REVISED FEBRUARY 2012
APPLICATION INFORMATION
SET-POINT RESISTOR (RSET)
The temperature threshold is set by connecting RSET from the SET pin to GND. The value of RSET can be
determined using either Figure 2 or from Equation 1:
RSET (kΩ) = 0.0012T
2 – 0.9308T + 96.147
Where T = temperature threshold in degree Celsius.
(1)
THERMAL CONSIDERATIONS
The TMP709 quiescent current is typically 40
μA. The device dissipates negligible power when the output drives
a high-impedance load. Thus, the die temperature is the same as the package temperature. In order to maintain
accurate temperature monitoring, a good thermal contact should be provided between the TMP709 package and
the device being monitored. The rise in die temperature as a result of self-heating is given by the following
equation:
ΔTJ = PDISS × θJA
Where:
PDISS = power dissipated by the device.
θJA = package thermal resistance. Typical thermal resistance for SOT-23 package is 217.9°C/W.
(2)
To minimize the effects of self-heating, keep the output current at a minimum level.
POWER-SUPPLY FILTERING
Any significant noise on the VCC pin may result in a trip-point error. This noise can be minimized levels by
low-pass filtering the device supply (VCC) using a 150-Ω resistor and a 0.1-μF capacitor.
Copyright
© 2011–2012, Texas Instruments Incorporated
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