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TMP513 Fiches technique(PDF) 3 Page - Texas Instruments

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No de pièce TMP513
Description  Temperature and Power Supply System Monitors
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
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TMP513 Fiches technique(HTML) 3 Page - Texas Instruments

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TMP512
TMP513
www.ti.com
SBOS491A
– JUNE 2010 – REVISED MAY 2011
THERMAL INFORMATION
TMP512AIRSAR
TMP512
TMP512AIRSAT
THERMAL METRIC(1)
UNITS
D (SOIC)
RSA
14
16
θJA
Junction-to-ambient thermal resistance
91.1
34.3
θJC(top)
Junction-to-case(top) thermal resistance
10.6
35.4
θJB
Junction-to-board thermal resistance
40.3
11.6
°C/W
ψJT
Junction-to-top characterization parameter
49.1
0.5
ψJB
Junction-to-board characterization parameter
47.5
11.6
θJC(bottom)
Junction-to-case(bottom) thermal resistance
N/A
2.7
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION
TMP513AIRSAR
TMP513AID
TMP513AIRSAT
THERMAL METRIC(1)
UNITS
D (SOIC)
RSA
16
16
θJA
Junction-to-ambient thermal resistance
77.6
44.8
θJC(top)
Junction-to-case(top) thermal resistance
55.0
43.8
θJB
Junction-to-board thermal resistance
49.9
14.7
°C/W
ψJT
Junction-to-top characterization parameter
3.5
0.4
ψJB
Junction-to-board characterization parameter
32.2
14.5
θJC(bottom)
Junction-to-case(bottom) thermal resistance
N/A
2.6
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright
© 2010–2011, Texas Instruments Incorporated
3


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