© Semiconductor Components Industries, LLC, 2015

August, 2015 − Rev. 2

1

Publication Order Number:

ESD5004/D

ESD5004

ESD Protection Diode

Low Capacitance ESD Protection Diode

The ESD5004 is designed for applications requiring ESD

protection. It is intended to be used in sensitive equipment such as

smartphone, wireless headsets, digital cameras, computers, printers,

communication systems, and other applications. The integrated design

provides very effective and reliable protection for four separate lines

using only one package. This device is ideal for situations where board

space is at a premium.

Features

IEC 61000−4−2 (Level 4)

Compliant

Typical Applications

Rating

Symbol

Value

Unit

Operating Junction Temperature Range

− 55 to +125

°C

Storage Temperature Range

− 65 to +150

°C

Lead Solder Temperature −

Maximum (10 Seconds)

260

°C

IEC 61000−4−2 Contact (ESD)

IEC 61000−4−2 Air (ESD)

ESD

ESD

±10

±15

kV

kV

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

See Application Note AND8308/D for further description of

survivability specs.

MARKING

DIAGRAM

Device

Package

ORDERING INFORMATION

X3DFN4

CASE 714AA

PIN CONFIGURATION

AND SCHEMATIC

www.onsemi.com

ESD5004MXTBG

X3DFN4

(Pb−Free)

8000 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

(Bottom View)

2

1

3

4

5

5

12

3

4

4

= Specific Device Code

M

= Date Code

4M