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MTV6N100E Fiches technique(PDF) 8 Page - ON Semiconductor |
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MTV6N100E Fiches technique(HTML) 8 Page - ON Semiconductor |
8 / 11 page MTV6N100E http://onsemi.com 8 INFORMATION FOR USING THE DPAK SURFACE MOUNT PACKAGE RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.190 4.826 mm inches 0.100 2.54 0.063 1.6 0.165 4.191 0.118 3.0 0.243 6.172 POWER DISSIPATION FOR A SURFACE MOUNT DEVICE The power dissipation for a surface mount device is a function of the drain pad size. These can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows: PD = TJ(max) − TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device. For a D3PAK device, PD is calculated as follows. PD = 150°C − 25°C 62.5°C/W = 2.0 Watts The 62.5°C/W for the D3PAK package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 2.0 Watts. There are other alternatives to achieving higher power dissipation from the surface mount packages. One is to increase the area of the drain pad. By increasing the area of the drain pad, the power dissipation can be increased. Although one can almost double the power dissipation with this method, one will be giving up area on the printed circuit board which can defeat the purpose of using surface mount technology. For example, a graph of RθJA versus drain pad area is shown in Figure 15. Figure 16. Thermal Resistance versus Drain Pad Area for the D3PAK Package (Typical) 1.75 Watts Board Material = 0.0625″ G−10/FR−4, 2 oz Copper 80 100 60 40 20 10 8 6 4 2 0 3.0 Watts 5.0 Watts TA = 25°C A, AREA (SQUARE INCHES) Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad™. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. |
Numéro de pièce similaire - MTV6N100E |
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Description similaire - MTV6N100E |
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