LC87F2708A

No.A1335-11/24

Parameter

Symbol

Pin/Remarks

Conditions

Specification

VDD[V]

min.

typ.

max.

unit

Maximum supply

voltage

VDDMAX

VDD1

0.3

to

+6.5

V

Input voltage

VI

RES#

0.3

to

VDD+0.3

Input/output

voltage

VIO

 Port 1

 Port 3

0.3

to

VDD+0.3

Peak output

current

IOPH(1)

Port 1

 CMOS output selected

 Per applicable pin

7.5

mA

IOPH(2)

Port 3

 CMOS output selected

 Per applicable pin

10

Mean output

current

(Note 1-1)

IOMH(1)

Port 1

 CMOS output selected

 Per applicable pin

5

IOMH(2)

Port 3

 CMOS output selected

 Per applicable pin

7.5

Total output

current

IOAH(1)

 Ports 10, 15,

16

 Ports 30, 31

Total of currents at all

applicable pins

20

IOAH(2)

 Ports 11 to 14

 Ports 32, 33

Total of currents at all

applicable pins

20

IOAH(3)

 Port 1

 Port 3

Total of currents at all

applicable pins

35

Peak output

current

IOPL(1)

Port 1

Per applicable pin

15

IOPL(2)

Port 3

Per applicable pin

10

Mean output

current

(Note 1-1)

IOML(1)

Port 1

Per applicable pin

10

IOML(2)

Port 3

Per applicable pin

7.5

Total output

current

IOAL(1)

 Port 10

 Ports 30, 31

Total of currents at all

applicable pins

25

IOAL(2)

 Ports 11 to 16

 Ports 32, 33

Total of currents at all

applicable pins

35

IOAL(3)

 Port 1

 Port 3

Total of currents at all

applicable pins

55

Power dissipation

Pdmax(1)

MFP14S

 Ta=

40 to +85C

 Independent package

113

mW

Pdmax(2)

 Ta=

40 to +85C

 Mounted on thermal

test board

 (Note 1-2)

260

Operating ambient

temperature

Topr

40

to

+85

C

Storage ambient

temperature

Tstg

55

to

+125

Note 1-1: Mean output current refers to the average of output currents measured for a period of 100ms.

Note 1-2: Thermal test board used conforms to SEMI (size : 76.1

114.3 1.6 tmm, glass epoxy board).

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,

damage may occur and reliability may be affected.