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BTA208X-1000B Fiches technique(PDF) 10 Page - NXP Semiconductors |
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BTA208X-1000B Fiches technique(HTML) 10 Page - NXP Semiconductors |
10 / 13 page NXP Semiconductors BTA208X-1000B 3Q Hi-Com Triac BTA208X-1000B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved Product data sheet 22 May 2014 10 / 13 11. Package outline REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT186A 3-lead TO-220F 0 5 10 mm scale Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 'full pack' SOT186A A A1 Q c K j Notes 1. Terminal dimensions within this zone are uncontrolled. 2. Both recesses are # 2.5 × 0.8 max. depth D D1 L L2 L1 b1 b2 e1 e b w M 1 2 3 q E P T UNIT D b1 D1 e q Q P L c L2 (1) max. e1 A 5.08 3 mm 4.6 4.0 A1 2.9 2.5 b 0.9 0.7 1.1 0.9 b2 1.4 1.0 0.7 0.4 15.8 15.2 6.5 6.3 E 10.3 9.7 2.54 14.4 13.5 T (2) 2.5 0.4 L1 3.30 2.79 j 2.7 1.7 K 0.6 0.4 2.6 2.3 3.0 2.6 w 3.2 3.0 DIMENSIONS (mm are the original dimensions) 02-04-09 06-02-14 mounting base Fig. 13. Package outline TO-220F (SOT186A) |
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