Moteur de recherche de fiches techniques de composants électroniques |
|
CSD87351ZQ5D Fiches technique(PDF) 2 Page - Texas Instruments |
|
CSD87351ZQ5D Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 22 page CSD87351ZQ5D SLPS426 – DECEMBER 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS TA = 25°C (unless otherwise noted) (1) Parameter Conditions VALUE UNIT VIN to PGND -0.8 to 30 V Voltage range TG to TGR -0.8 to 10 V BG to PGND -8 to 10 V Pulsed Current Rating, IDM 96 A Power Dissipation, PD 12 W Sync FET, ID = 87A, L = 0.1mH 378 Avalanche Energy EAS mJ Control FET, ID = 44A, L = 0.1mH 87 Operating Junction and Storage Temperature Range, TJ, TSTG -55 to 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute- maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS TA = 25° (unless otherwise noted) Parameter Conditions MIN MAX UNIT Gate Drive Voltage, VGS 4.5 8 V Input Supply Voltage, VIN 27 V Switching Frequency, fSW CBST = 0.1μF (min) 200 1500 kHz Operating Current 32 A Operating Temperature, TJ 125 °C POWER BLOCK PERFORMANCE TA = 25° (unless otherwise noted) Parameter Conditions MIN TYP MAX UNIT VIN = 12V, VGS = 5V, VOUT = 1.3V, IOUT = 20A, Power Loss, PLOSS (1) 2.5 W fSW = 500kHz, LOUT = 0.3µH, TJ = 25ºC TG to TGR = 0V VIN Quiescent Current, IQVIN 10 µA BG to PGND = 0V (1) Measurement made with six 10µF (TDK C3216X5R1C106KT or equivalent) ceramic capacitors placed across VIN to PGND pins and using a high current 5V driver IC. THERMAL INFORMATION TA = 25°C (unless otherwise stated) THERMAL METRIC MIN TYP MAX UNIT Junction to ambient thermal resistance (Min Cu) (1)(2) 119 RθJA Junction to ambient thermal resistance (Max Cu) (1)(2) 62 °C/W Junction to case thermal resistance (Top of package) (2) 25 RθJC Junction to case thermal resistance (PGND Pin) (2) 2.3 (1) Device mounted on FR4 material with 1-inch2 (6.45-cm2) Cu. (2) RθJC is determined with the device mounted on a 1-inch 2 (6.45-cm2), 2 oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board design. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated |
Numéro de pièce similaire - CSD87351ZQ5D_15 |
|
Description similaire - CSD87351ZQ5D_15 |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |