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CSD87351ZQ5D Fiches technique(PDF) 2 Page - Texas Instruments

No de pièce CSD87351ZQ5D
Description  Synchronous Buck NexFET??Power Block
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

CSD87351ZQ5D Fiches technique(HTML) 2 Page - Texas Instruments

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CSD87351ZQ5D
SLPS426 – DECEMBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
TA = 25°C (unless otherwise noted)
(1)
Parameter
Conditions
VALUE
UNIT
VIN to PGND
-0.8 to 30
V
Voltage range
TG to TGR
-0.8 to 10
V
BG to PGND
-8 to 10
V
Pulsed Current Rating, IDM
96
A
Power Dissipation, PD
12
W
Sync FET, ID = 87A, L = 0.1mH
378
Avalanche Energy EAS
mJ
Control FET, ID = 44A, L = 0.1mH
87
Operating Junction and Storage Temperature Range, TJ, TSTG
-55 to 150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
TA = 25° (unless otherwise noted)
Parameter
Conditions
MIN
MAX
UNIT
Gate Drive Voltage, VGS
4.5
8
V
Input Supply Voltage, VIN
27
V
Switching Frequency, fSW
CBST = 0.1μF (min)
200
1500
kHz
Operating Current
32
A
Operating Temperature, TJ
125
°C
POWER BLOCK PERFORMANCE
TA = 25° (unless otherwise noted)
Parameter
Conditions
MIN
TYP
MAX
UNIT
VIN = 12V, VGS = 5V,
VOUT = 1.3V, IOUT = 20A,
Power Loss, PLOSS
(1)
2.5
W
fSW = 500kHz,
LOUT = 0.3µH, TJ = 25ºC
TG to TGR = 0V
VIN Quiescent Current, IQVIN
10
µA
BG to PGND = 0V
(1)
Measurement made with six 10µF (TDK C3216X5R1C106KT or equivalent) ceramic capacitors placed across VIN to PGND pins and
using a high current 5V driver IC.
THERMAL INFORMATION
TA = 25°C (unless otherwise stated)
THERMAL METRIC
MIN
TYP
MAX
UNIT
Junction to ambient thermal resistance (Min Cu) (1)(2)
119
RθJA
Junction to ambient thermal resistance (Max Cu) (1)(2)
62
°C/W
Junction to case thermal resistance (Top of package) (2)
25
RθJC
Junction to case thermal resistance (PGND Pin)
(2)
2.3
(1)
Device mounted on FR4 material with 1-inch2 (6.45-cm2) Cu.
(2)
RθJC is determined with the device mounted on a 1-inch
2 (6.45-cm2), 2 oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch
(3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board
design.
2
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Copyright © 2012, Texas Instruments Incorporated


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