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TSI382A Fiches technique(PDF) 2 Page - Integrated Device Technology |
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TSI382A Fiches technique(HTML) 2 Page - Integrated Device Technology |
2 / 2 page Tundra Semiconductor Corporation 603 March Road, Ottawa, Ontario, Canada, K2K 2M5 Phone: +1 613-592-0714 Toll-free: 800-267-7231 Fax: +1 613-592-1320 Email: info@tundra.com Document: 80E2040_FB001_01 ©2009 Tundra Semiconductor Corporation All trademarks are property of their respective owners. Information is subject to change without notice. Tsi382 PCI Express to PCI Bridge Low Power Consumption The Tsi382A has typical power consumption of less than 0.7W, and it incorporates advanced power management modes to minimize consumption during operation. High Performance In addition to low-latency operation, the Tsi382A’s superior queueing architecture and rich feature set allow designers to optimize their overall system performance. Features such as short-term caching also enable designers to tune the device’s performance for different applications. Transparent and Non-transparent Bridging Transparent mode operation is available for efficient, flow-through configurations, while non-transparent bridging enables multi-host systems and is used in applications such as intelligent adapter cards. Typical Applications The Tsi382A is suited to applications that need to bridge PCIe to downstream PCI devices. Its flexibility, high performance, small footprint, and low power consumption, make it ideal for a range of applications, including: • Motherboards • PC adapter cards (communications, graphics, imaging, and multimedia) • Digital video recorders • ExpressCards for laptop computers • Multifunction printers • Line cards and NICs Motherboard Application 80E2040_TA001_01 PCI 10x10 mm footprint Supports up to four PCI devices off x1 PCIe PCIe Tsi382A PCI Slot PCI Slot Processor Chipset CPU PCIe Slot Peripherals Graphics Memory Other Features • Masquerade mode • JTAG IEEE 1149.1, 1149.6 • Four GPIO pins and four interrupt pins that can generate MSIs • D0, D3 hot, D3 cold power management state support • 1.2V core power supply, 3.3V I/O • No power sequencing constraints • Packaging: – BGA: 144-pin, 10 x 10 mm, 0.8 mm ball pitch, Industrial operating temperature, RoHS/Green compliant – LQFP: 176-pin, 20 x 20 mm, Commercial operating temperature, RoHS compliant Benefits • Enhances system performance by delivering high throughput and low latency across the bridge • Simplifies system design by offering numerous programmable features • Minimizes board space due to small footprint of BGA package Design Support Tools Tundra is committed to helping customers minimize their time to market. That’s why we provide one of the highest levels of design support in the industry, including: • Application notes • Evaluation boards •IC models • Hardware and software development tools Tundra Confidential |
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