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LMZ21701 Fiches technique(PDF) 9 Page - Texas Instruments |
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LMZ21701 Fiches technique(HTML) 9 Page - Texas Instruments |
9 / 37 page INDUCTOR EMBEDDED BUCK IC FR-4 LAMINATE SUBSTRATE BOTTOM COPPER PATTERN LMZ21701 www.ti.com SNVS853D – AUGUST 2012 – REVISED NOVEMBER 2014 8.3 Package Construction In order to achieve a small solution size the LMZ21701 Nano Module comes in an innovative MicroSiP™ package. The construction consists of a synchronous buck converter IC embedded inside an FR-4 laminate substrate, with a power inductor mounted on top of the substrate material. See Figure 12 and Figure 13 below. The bottom (landing pads) of the package resemble a typical 8-pin DFN package. See the Mechanical drawings at the end of the datasheet for details on the recommended landing pattern and solder paste stencil information. Figure 12. LMZ21701 in the SIL0008E Package Figure 13. LMZ21701 Package Construction Cross Section (Illustration Only, Not to Scale) Copyright © 2012–2014, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: LMZ21701 |
Numéro de pièce similaire - LMZ21701_15 |
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Description similaire - LMZ21701_15 |
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