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74CBTLV16211 Fiches technique(PDF) 11 Page - NXP Semiconductors |
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74CBTLV16211 Fiches technique(HTML) 11 Page - NXP Semiconductors |
11 / 16 page 74CBTLV16211 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 6 — 15 December 2011 11 of 16 NXP Semiconductors 74CBTLV16211 24-bit bus switch 12. Package outline Fig 16. Package outline SOT364-1 (TSSOP56) UNIT A1 A2 A3 bp cD(1) E(2) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.2 0.1 8 0 o o 0.1 DIMENSIONS (mm are the original dimensions). Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. SOT364-1 99-12-27 03-02-19 w M θ A A1 A2 D L p Q detail X E Z e c L X (A ) 3 0.25 128 56 29 y pin 1 index b H 1.05 0.85 0.28 0.17 0.2 0.1 14.1 13.9 6.2 6.0 0.5 1 8.3 7.9 0.50 0.35 0.5 0.1 0.08 0.25 0.8 0.4 p E v M A A TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 A max. 1.2 0 2.5 5 mm scale MO-153 |
Numéro de pièce similaire - 74CBTLV16211_15 |
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Description similaire - 74CBTLV16211_15 |
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