MAX1901 datasheet(27/33 Pages) MAXIM

No de pièce	MAX1901

Description	500kHz Multi-Output, Low-Noise Power-Supply Controllers for Notebook Computers

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Fabricant	MAXIM [Maxim Integrated Products]

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27 / 33 page

500kHz Multi-Output, Low-Noise Power-Supply

Controllers for Notebook Computers

______________________________________________________________________________________

27

performance. In most applications, the circuit will be

located on a multilayer board, and full use of the four or

more copper layers is recommended. Use the top layer

for high-current connections, the bottom layer for quiet

connections (REF, SS, GND), and the inner layers for

an uninterrupted ground plane. Use the following step-

by-step guide:

1) Place the high-power components (Figure 1, C1, C3,

C4, Q1, Q2, L1, and R1) first, with their grounds

adjacent.

• Priority 1: Minimize current-sense resistor trace

lengths and ensure accurate current sensing with

Kelvin connections (Figure 9).

• Priority 2: Minimize ground trace lengths in the

high-current paths (discussed below).

• Priority 3: Minimize other trace lengths in the high

current paths.

Use >5mm-wide traces

CIN to high-side MOSFET drain: 10mm max

length

Rectifier diode cathode to low-side MOSFET:

5mm max length

LX node (MOSFETs, rectifier cathode, inductor):

15mm max length

Ideally, surface-mount power components are butted up

to one another with their ground terminals almost touch-

ing. These high-current grounds are then connected to

each other with a wide filled zone of top-layer copper so

they don’t go through vias. The resulting top layer “sub-

ground-plane” is connected to the normal inner-layer

ground plane at the output ground terminals, which

ensures that the IC’s analog ground is sensing at the sup-

ply’s output terminals without interference from IR drops

and ground noise. Other high-current paths should also

be minimized, but focusing primarily on short ground and

current-sense connections eliminates about 90% of all PC

board layout problems.

2) Place the IC and signal components. Keep the main

switching nodes (LX nodes) away from sensitive

analog components (current-sense traces and REF

capacitor). Place the IC and analog components on

the opposite side of the board from the power-

switching node. Important: the IC must be no more

than 10mm from the current-sense resistors. Keep

the gate-drive traces (DH_, DL_, and BST_) shorter

than 20mm and route them away from CSH_, CSL_,

and REF.

3) Use a single-point star ground where the input

ground trace, power ground (sub-ground-plane), and

normal ground plane meet at the supply’s output

ground terminal. Connect both IC ground pins and all

IC bypass capacitors to the normal ground plane.

MAX1901/MAX1902/MAX1904

SENSE RESISTOR

HIGH-CURRENT PATH

Figure 9. Kelvin Connections for the Current-Sense Resistors

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