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MAX1901 Fiches technique(PDF) 27 Page - Maxim Integrated Products |
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MAX1901 Fiches technique(HTML) 27 Page - Maxim Integrated Products |
27 / 33 page 500kHz Multi-Output, Low-Noise Power-Supply Controllers for Notebook Computers ______________________________________________________________________________________ 27 performance. In most applications, the circuit will be located on a multilayer board, and full use of the four or more copper layers is recommended. Use the top layer for high-current connections, the bottom layer for quiet connections (REF, SS, GND), and the inner layers for an uninterrupted ground plane. Use the following step- by-step guide: 1) Place the high-power components (Figure 1, C1, C3, C4, Q1, Q2, L1, and R1) first, with their grounds adjacent. • Priority 1: Minimize current-sense resistor trace lengths and ensure accurate current sensing with Kelvin connections (Figure 9). • Priority 2: Minimize ground trace lengths in the high-current paths (discussed below). • Priority 3: Minimize other trace lengths in the high current paths. Use >5mm-wide traces CIN to high-side MOSFET drain: 10mm max length Rectifier diode cathode to low-side MOSFET: 5mm max length LX node (MOSFETs, rectifier cathode, inductor): 15mm max length Ideally, surface-mount power components are butted up to one another with their ground terminals almost touch- ing. These high-current grounds are then connected to each other with a wide filled zone of top-layer copper so they don’t go through vias. The resulting top layer “sub- ground-plane” is connected to the normal inner-layer ground plane at the output ground terminals, which ensures that the IC’s analog ground is sensing at the sup- ply’s output terminals without interference from IR drops and ground noise. Other high-current paths should also be minimized, but focusing primarily on short ground and current-sense connections eliminates about 90% of all PC board layout problems. 2) Place the IC and signal components. Keep the main switching nodes (LX nodes) away from sensitive analog components (current-sense traces and REF capacitor). Place the IC and analog components on the opposite side of the board from the power- switching node. Important: the IC must be no more than 10mm from the current-sense resistors. Keep the gate-drive traces (DH_, DL_, and BST_) shorter than 20mm and route them away from CSH_, CSL_, and REF. 3) Use a single-point star ground where the input ground trace, power ground (sub-ground-plane), and normal ground plane meet at the supply’s output ground terminal. Connect both IC ground pins and all IC bypass capacitors to the normal ground plane. MAX1901/MAX1902/MAX1904 SENSE RESISTOR HIGH-CURRENT PATH Figure 9. Kelvin Connections for the Current-Sense Resistors |
Numéro de pièce similaire - MAX1901 |
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Description similaire - MAX1901 |
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