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BUJ303AX Fiches technique(PDF) 5 Page - NXP Semiconductors |
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BUJ303AX Fiches technique(HTML) 5 Page - NXP Semiconductors |
5 / 13 page BUJ303AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 8 February 2012 5 of 13 NXP Semiconductors BUJ303AX NPN power transistor 6. Isolation characteristics 7. Characteristics Table 6. Isolation characteristics Symbol Parameter Conditions Min Typ Max Unit Visol(RMS) RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; Th = 25 °C; from all terminals to external heatsink; clean and dust free - - 2500 V Cisol isolation capacitance from collector to external heatsink; f=1MHz; Th =25°C -10 -pF Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics ICES collector-emitter cut-off current VBE =0V; VCE = 1000 V; Th =25°C; Measured with half-sine wave voltage (curve tracer) --1 mA VBE =0V; VCE = 1000 V; Th = 125 °C; Measured with half-sine wave voltage (curve tracer) --2 mA ICBO collector-base cut-off current VCB = 1000 V; IE =0A; Th =25°C; Measured with half-sine wave voltage (curve tracer) --1 mA ICEO collector-emitter cut-off current VCE =500 V; IB =0A; Th =25°C; Measured with half-sine wave voltage (curve tracer) --0.1 mA IEBO emitter-base cut-off current VEB =9V; IC =0A; Th = 25 °C --0.1 mA VCEOsus collector-emitter sustaining voltage IB =0A; IC = 100 mA; LC =25mH; Th = 25 °C; see Figure 6; see Figure 7 500 - - V VCEsat collector-emitter saturation voltage IC =3.0 A; IB = 0.6 A; Th =25°C; see Figure 8; see Figure 9 - 0.35 1.5 V VBEsat base-emitter saturation voltage IC =3.0 A; IB = 0.6 A; Th =25°C; see Figure 10 - 1.01 1.3 V hFE DC current gain IC =5mA; VCE =5V; Th =25 °C; see Figure 11 10 22 35 IC =500 mA; VCE =5V; Th =25°C; see Figure 11 14 25 35 hFEsat DC saturation current gain IC =2.5 A; VCE =5V; Th =25°C; see Figure 11 10 13.5 17 IC =3.0 A; VCE =5V; Th =25°C; see Figure 11 -11 - Dynamic Characteristics (switching times - resistive load) ts turn-off delay time IC =2.5 A; IBon = 0.5 A; IBoff =-0.5A; RL =75 Ω; Th = 25 °C; see Figure 12; see Figure 13 -3.3 4 µs tf fall time - 0.33 0.45 µs |
Numéro de pièce similaire - BUJ303AX_15 |
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Description similaire - BUJ303AX_15 |
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