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IRF9395MPBF Fiches technique(PDF) 3 Page - International Rectifier |
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IRF9395MPBF Fiches technique(HTML) 3 Page - International Rectifier |
3 / 9 page 3 © 2014 International Rectifier Submit Datasheet Feedback February 24, 2014 IRF9395MPbF Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Rθ is measured at TJ of approximately 90°C. Surface mounted on 1 in. square Cu board (still air). 1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100 1000 t1 , Rectangular Pulse Duration (sec) 0.0001 0.001 0.01 0.1 1 10 100 0.20 0.10 D = 0.50 0.02 0.01 0.05 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthja + Tc Ri (°C/W) τi (sec) 10.609 0.239813 3.5414 0.007823 24.659 2.632793 21.032 18.15739 τ J τ J τ1 τ1 τ2 τ 2 τ3 τ3 R 1 R 1 R 2 R 2 R 3 R 3 Ci= τi/Ri Ci= τi/Ri τA τA τ 4 τ 4 R 4 R 4 Absolute Maximum Ratings Parameter Units PD @TA = 25°C Power Dissipation e PD @TA = 70°C Power Dissipation e PD @TC = 25°C Power Dissipation f TP Peak Soldering Temperature TJ Operating Junction and TSTG Storage Temperature Range Thermal Resistance Parameter Typ. Max. Units RθJA Junction-to-Ambient e ––– 60 RθJA Junction-to-Ambient i 12.5 ––– RθJA Junction-to-Ambient j 20 ––– °C/W RθJC Junction-to-Case f,k ––– 2.2 RθJ-PCB Junction-to-PCB Mounted 1.0 ––– Linear Derating Factor e W/°C 0.02 270 -40 to + 150 Max. 57 2.1 1.3 W °C Mounted to a PCB with small clip heatsink (still air) Mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air) Used double sided cooling, mounting pad with large heatsink. Mounted on minimum footprint full size board with metalized back and with small clip heatsink. Notes: |
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