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AN3339 Fiches technique(PDF) 26 Page - STMicroelectronics |
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AN3339 Fiches technique(HTML) 26 Page - STMicroelectronics |
26 / 44 page Thermal map AN3339 26/44 Doc ID 18449 Rev 2 5 Thermal map In order to check the design reliability, a thermal mapping by means of an IR camera was done. In Figure 49 and 50 the thermal measurements of the board component side at nominal input voltage are shown. Some pointers, visible in the images, have been placed across key components. The ambient temperature during both measurements was 25 °C. Figure 49. Thermal map at 115 Vac - 60 Hz, full load Figure 50. Thermal map at 230 Vac - 50 Hz, full load |
Numéro de pièce similaire - AN3339 |
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Description similaire - AN3339 |
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