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AD9300 Fiches technique(PDF) 4 Page - Analog Devices

No de pièce AD9300
Description  Video Multiplexer
Download  8 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD9300 Fiches technique(HTML) 4 Page - Analog Devices

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AD9300
–4–
REV. A
SUGGESTED LAYOUT OF AD9300
PC BOARD
AD9300 BURN-IN DIAGRAM
AD9300 Timing Diagram
METALIZATION PHOTOGRAPH
MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . . . . . . . . . 84
× 104 × 18 (max) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 4
× 4 (min) mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding
or 1 mil, Gold; Gold Ball Bonding
LOGIC TRUTH TABLE
ENABLE
A1
A0
OUTPUT
0
X
X
High Z
10
0
IN1
10
1
IN2
11
0
IN3
11
1
IN4
FUNCTIONAL DESCRIPTION
IN1–IN4
Four analog input channels.
GROUND
Analog input shielding grounds, not internally con-
nected. Connect each to external low-impedance
ground as close to device as possible.
A0
One of two TTL decode control lines required for
channel selection. See Logic Truth Table.
A1
One of two TTL decode control lines required for
channel selection. See Logic Truth Table.
ENABLE
TTL-compatible chip enable. In enabled mode
(logic HIGH), output signal tracks selected input
channel; in disabled mode (logic LOW), output is
high impedance and no signal appears at output.
–VS
Negative supply voltage; normally –10 V dc to
–15 V dc.
+VS
Positive supply voltage; normally +10 V dc to
+15 V dc.
OUTPUT
Analog output. Tracks selected input channel when
enabled.
BYPASS
Bypass terminal for internal bias line; must be
decoupled externally to ground through 0.1
µF
capacitor.
GROUND
Analog signal and power supply ground return.
RETURN


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