AD7827

–4–

REV. 0

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7827 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

PIN FUNCTION DESCRIPTIONS

Pin No.

Mnemonic

Description

1

CONVST

Convert Start. Puts the track-and-

hold into hold mode and initiates a

conversion.

The state of this pin at the end of

conversion also determines whether

or not the part is powered down.

2V

IN

Analog Input is applied here.

3

RFS

Receive Frame Sync. This is an

output. When this signal goes logic

high at the end of a conversion, the

DSP starts latching in data on the

next cycle of SCLK.

4

GND

Ground reference for analog and

digital circuitry.

5V

REF

Reference Input.

6D

OUT

Serial Data is shifted out on this pin.

Data is clocked out by the rising

edges of SCLK.

7

SCLK

Serial Clock. An external serial clock

is applied here. The clock must be

continuous so the RFS (frame SYNC)

can be synchronized to the clock for

high speed data transfers. (See

Microprocessor Interfacing section.)

8V

DD

Positive Supply Voltage 3 V/5 V

± 10%.

PIN CONFIGURATION

TOP VIEW

(Not to Scale)

8

7

6

5

1

2

3

4

CONVST

RFS

SCLK

GND

AD7827

ABSOLUTE MAXIMUM RATINGS*

Digital Input Voltage to GND

(

CONVST, SCLK) . . . . . . . . . . . . . . –0.3 V, V

Digital Output Voltage to GND

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . –40

°C to +105°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +300

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW

θ

Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

θ

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 kV

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

ORDERING GUIDE

Linearity

Error

Package

Package

Model

(LSB)

Description

Option

AD7827BN

±0.5 LSB

Plastic DIP

N-8

AD7827BR

±0.5 LSB

Small Outline IC

SO-8