Moteur de recherche de fiches techniques de composants électroniques |
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CD4020BMS Fiches technique(PDF) 9 Page - Intersil Corporation |
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CD4020BMS Fiches technique(HTML) 9 Page - Intersil Corporation |
9 / 10 page 7-367 CD4020BMS, CD4024BMS, CD4040BMS METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF INPUT PULSE FREQUENCY FOR CD4020BMS FIGURE 11. DETAIL OF TYPICAL FLIP-FLOP STAGES Chip Dimensions and Pad Layouts DIMENSIONS AND PAD LAYOUT FOR CD4020BMS. DIMEN- SIONS AND PAD LAYOUT FOR CD4040BMS ARE IDENTICAL DIMENSIONS AND PAD LAYOUT FOR CD4024BMSH Typical Performance Characteristics (Continued) 105 104 103 102 10 8 6 4 2 8 6 4 2 8 6 4 2 8 6 4 2 110 102 103 104 105 8 6 4 28 6 4 28 6 4 28 6 4 28 6 4 2 INPUT PULSE FREQUENCY (f φ) (kHz) AMBIENT TEMPERATURE (TA) = +25 oC SUPPLY VOLTAGE (VDD) = 5V 5V 10V 10V CD = 15pF CL = 50pF ∅ ∅ p n ∅ ∅ p n ∅ ∅ p n R R R ∅ ∅ p n * * ON FIRST STAGE ONLY Q1 Q Q Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch) |
Numéro de pièce similaire - CD4020BMS |
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Description similaire - CD4020BMS |
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