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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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SI6975DQ-T1-E3 Fiches technique(PDF) 6 Page - Vishay Siliconix |
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SI6975DQ-T1-E3 Fiches technique(HTML) 6 Page - Vishay Siliconix |
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6 / 10 page  AN1001 Vishay Siliconix Document Number: 70571 12-Dec-03 www.vishay.com 1 LITTLE FOOTR TSSOP-8 The Next Step in Surface-Mount Power MOSFETs Wharton McDaniel and David Oldham When Vishay Siliconix introduced its LITTLE FOOT MOSFETs, it was the first time that power MOSFETs had been offered in a true surface-mount package, the SOIC. LITTLE FOOT immediately found a home in new small form factor disk drives, computers, and cellular phones. The new LITTLE FOOT TSSOP-8 power MOSFETs are the natural evolutionary response to the continuing demands of many markets for smaller and smaller packages. LITTLE FOOT TSSOP-8 MOSFETs have a smaller footprint and a lower profile than LITTLE FOOT SOICs, while maintaining low rDS(on) and high thermal performance. Vishay Siliconix has accomplished this by putting one or two high-density MOSFET die in a standard 8-pin TSSOP package mounted on a custom leadframe. THE TSSOP-8 PACKAGE LITTLE FOOT TSSOP-8 power MOSFETs require approximately half the PC board area of an equivalent LITTLE FOOT device (Figure 1). In addition to the reduction in board area, the package height has been reduced to 1.1 mm. Top View Side View Figure 1. An TSSOP-8 Package Next to a SOIC-8 Package with Views from Both Top and Side This is the low profile demanded by applications such as PCMCIA cards. It reduces the power package to the same height as many resistors and capacitors in 0805 and 0605 sizes. It also allows placement on the “passive” side of the PC board. The standard pinouts of the LITTLE FOOT TSSOP-8 packages have been changed from the standard established by LITTLE FOOT. This change minimizes the contribution of interconnection resistance to rDS(on) and maximizes the transfer of heat out of the package. Figure 2 shows the pinouts for a single-die TSSOP. Notice that both sides of the package have Source and Drain connections, whereas LITTLE FOOT has the Source and Gate connections on one side of the package, and the Drain connections are on the opposite side. Figure 2. Pinouts for Single Die TSSOP Drain Source Source Gate Source Source Drain Drain Figure 3 shows the standard pinouts for a dual-die TSSOP-8. In this case, the connections for each individual MOSFET occupy one side. Figure 3. Pinouts for Dual-Die TSSOP Drain 1 Source 1 Source 1 Gate 1 Source 2 Source 2 Drain 2 Gate 2 |
Numéro de pièce similaire - SI6975DQ-T1-E3 |
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Description similaire - SI6975DQ-T1-E3 |
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