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HMMC-2027 Fiches technique(PDF) 6 Page - Agilent(Hewlett-Packard) |
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HMMC-2027 Fiches technique(HTML) 6 Page - Agilent(Hewlett-Packard) |
6 / 6 page 7-37 This data sheet contains a variety of typical and guaranteed performance data. The information supplied should not be interpreted as a complete list of circuit specifica- tions. In this data sheet the term typical refers to the 50th percentile performance. For additional information contact your local HP sales representative. Note: All compression data measured in an individual device mounted in an HP83040 Series Modular Microcircuit Package @ Tcase = 25°C. Figure 8. HMMC-2027 Bonding Pad Locations. (Dimensions in micrometers) 450 70 375 830 0 70 0 740 900 960 RF IN RF OUT2 CHIP ID 740 RF OUT1 SEL1 SEL2 525 |
Numéro de pièce similaire - HMMC-2027 |
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Description similaire - HMMC-2027 |
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