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TMP302C-Q1 Fiches technique(PDF) 4 Page - Texas Instruments

No de pièce TMP302C-Q1
Description  TMP302x-Q1, Automotive Grade, Low-Power, Easy-to-Use
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

TMP302C-Q1 Fiches technique(HTML) 4 Page - Texas Instruments

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TMP302A-Q1, TMP302B-Q1, TMP302C-Q1, TMP302D-Q1
SLOS889A – OCTOBER 2014 – REVISED NOVEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage
3.6
V
Input pin voltage
TRIPSET0, TRIPSET1, HYSTSET
–0.5
VS + 0.5
V
Output pin voltage
OUT
–0.5
3.6
V
Output pin current
OUT
10
mA
Operating temperature
–55
130
°C
Junction temperature range
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–60
150
°C
Human body model (HBM), per AEC Q100-002(1)
–2
2
V(ESD)
Electrostatic discharge
kV
Charged device model (CDM), per AEC Q100-011
–1
1
(1)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VS
Power supply voltage
1.4
3.3
3.6
V
Rpullup
Pullup resistor connected from OUT to VS
10
100
k
Ω
7.4 Thermal Information
DRL
THERMAL METRIC(1)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
200
RθJC(top)
Junction-to-case (top) thermal resistance
73.7
RθJB
Junction-to-board thermal resistance
34.4
°C/W
ψJT
Junction-to-top characterization parameter
3.1
ψJB
Junction-to-board characterization parameter
34.2
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: TMP302A-Q1 TMP302B-Q1 TMP302C-Q1 TMP302D-Q1


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