BCW66GLT1G, SBCW66GLT1G

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4

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−08

ISSUE AP

D

A1

3

12

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS.

mm

inches

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079

SOLDERING FOOTPRINT

VIEW C

L

0.25

L1

q

e

E

E

b

A

SEE VIEW C

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

0.89

1.00

1.11

0.035

INCHES

A1

0.01

0.06

0.10

0.001

b

0.37

0.44

0.50

0.015

c

0.09

0.13

0.18

0.003

D

2.80

2.90

3.04

0.110

E

1.20

1.30

1.40

0.047

e

1.78

1.90

2.04

0.070

L

0.10

0.20

0.30

0.004

0.040

0.044

0.002

0.004

0.018

0.020

0.005

0.007

0.114

0.120

0.051

0.055

0.075

0.081

0.008

0.012

NOM

MAX

L1

H

2.10

2.40

2.64

0.083

0.094

0.104

0.35

0.54

0.69

0.014

0.021

0.029

c

0

−−−

10

0

−−−

10

q

°

°

°

°

STYLE 6:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,

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particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without

limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC

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BCW66GLT1/D

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