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TS3A226AE Fiches technique(PDF) 3 Page - Texas Instruments

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No de pièce TS3A226AE
Description  Autonomous Audio Headset Switch with Reduced GND Switch RON and FM Capability
Download  12 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

TS3A226AE Fiches technique(HTML) 3 Page - Texas Instruments

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MICp
SLEEVE
RING2
SW1
SW2
TS3A226AE
www.ti.com
SCDS346A – JUNE 2013 – REVISED JULY 2013
S1 MUX DETAIL
Figure 2. S1 Mux Detail
FUNCTIONAL TABLES: INTERNAL SWITCHES
EN
Accessory Type
Accessory Configuration
SW1
SW2
FET1
FET2
0
N/A
High Z
High Z
High Z
High Z
TIP = Audio Left
1
TRS 3-pole Headphone or Speaker
Ring = Audio Right
On
On
On
On
Sleeve = Ground
TIP = Audio Left
Ring1 = Audio Right
1
TRRS 4-pole Headphone
On
High Z
High Z
On
Ring2 = Ground
Sleeve = Microphone
TIP = Audio Left
Ring1 = Audio Right
1
TRRS 4-pole Headphone
High Z
On
On
High Z
Ring2 = Microphone
Sleeve = Ground
1
N/A
On
On
On
On
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Voltage range on VDD(2)
–0.3 to 5
V
VI
Voltage range on EN, MICP, RING2, SLEEVE, TIP (2)
–0.3 to VDD+0.5
V
TA
Operating ambient temperature range(3)
–40 to 85
°C
TJ (MAX)
Maximum operating junction temperature
125
°C
Tstg
Storage temperature range
–65 to 150
°C
Charge device model (JESD 22 C101)
500
V
ESD rating Human body model(JESD 22 A114)
2
kV
Contact discharge on RING2, SLEEVE, TIP (IEC 61000-4-2)
8
kV
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the
maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package
in the application (
θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max))
Copyright © 2013, Texas Instruments Incorporated
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