LM3551, LM3552

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SNVS371C – AUGUST 2005 – REVISED MARCH 2011

Absolute Maximum Ratings

(1) (2) (3)

7.5V

SW pin: Voltage to GND

21V

FB pin: Voltage to GND

7V

1.26V ± 0.3V

SD,T/F pins: Voltage to GND

7.5V

FET-T, FET-F: Voltage to GND

6V

Internally Limited

150°C

Storage Temperature Range

-65°C to +150

Human Body Model

2.0kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

(5)

The human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7)

Operating Ratings

(1) (2)

Input Voltage Range

2.7V to 5.5V

20V

-40°C to +110°C

(4)

-40°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Maximum recommended SW pin voltage when the OVP pin is grounded.

(4)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

Thermal Properties

Junction-to-Ambient Thermal Resistance (

(1)

37.3°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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